Siemens
As a 3DIC SI/PI Applications Engineer, you’re responsible for driving the technical engagements with customers for Siemen’s Signal Integrity, Power Integrity and EM products focused on the area of 2.5D/3D IC heterogenous packaging. You’ll work collaboratively with a wide range of customers from startups to large enterprise organizations with the objective of understanding their needs, mapping Siemens solutions to the customer problem, performing product demonstrations, and managing evaluations and benchmarks with the customers. Being a subject matter expert, you’ll also take a leadership role in helping other AEs become familiar with these new packaging technologies and assisting them in applying our solutions to this design space.
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