Amkor Technology

Enabling the Future

The Technical Program Manager (TPM) works with a team of program managers in conjunction with the account manager and customer service team in all technical aspects of the customer engagement. The TPM is responsible for first-level technical support of the customer, aids in the development of account strategy, and provides critical feedback on Amkor’s ability to align to customer needs. These activities can include technical Q&A, design generation, implementation of change notices, audit preparation and participation, resolution of technical issues, technical presentations and factory visits with the customer. Amkor is seeking a qualified individual to join the team in San Diego, CA.

• Manage new product introductions (NPI) with Amkor factory teams abroad
• Enable faster and more responsive communication between customer based packaging managers and Amkor’s factory engineering staff
• Create and analyze DOEs that both support customer data gathering needs on new products as well as consider Amkor’s factory resources
• Align Amkor materials and package development roadmaps with next generation products
• Coordinate customer visits for periodic Technical Review Meetings
• Proactively drive cost reduction initiatives and planning
• Attend and drive subcon meetings where Amkor technology or product development/NPI is reviewed
• Drive orders for tooling and substrates, etc. in the pursuit of ensuring smooth NPI of new designs
• Guide customer packaging strategies to align with lowest cost; and best performance products to ensure customer product success in their market
• Provide technical customer support
• Initiate customer designs and follow-up (does not include design development)
• Customer Quality Support (drive & manage preparation and execution of audits, PCN, 8D follow-up)
• Contribute to strategic customer positioning and technical alignment
• Resolve technical issues in the areas of packaging, processing, materials
• Create and deliver assembly technology presentations

Required Qualifications:

• Bachelor’s Degree in Engineering, or related technical field such as Materials Science
• The Technical Program Manager (TPM) should be knowledgeable in the processes, materials, and applications for semiconductor packaging. A minimum of 8 years of relevant work experience is required
• The ideal candidate needs to be able to work with the customer on a daily basis; demonstrated experience with problem solving and reporting the status of on-going as well as future programs is needed; must possess excellent program management skills
• Demonstrated ability to communicate in both large and small groups with excellent presentation skills
• Must be flexible to work within both US and Asian business hours
• Must be self-driven and show initiative and excellent follow-up on active programs with multiple customers
• Proficiency with MS Office Suite (Excel, Word, and PowerPoint) is required
• Proficiency with SPC, DOE, FMEA
• Must be proficient in communicating in English

• Fluency in the Korean or Chinese language is desirable