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Amkor Technology

Enabling the Future

Amkor Technology is hiring a senior-level technical resource with experience in package design. In this capacity, the Sr. Design Engineer is expected to provide guidance and complete multiple complex designs to meet various customer requirements while understanding and implementing cost-saving techniques. The Sr. Design Engineer has an expert understanding of package design and package design tools (Cadence, CAM, etc…) that are used in the industry. They require little or no supervision and can provide technical support and training to colleagues. This position requires advanced skills and experience to meet or exceed customer requirements and solve complex design problems and customer issues. The Sr. Design Engineer seeks opportunities to improve design techniques and streamline the design process. They exercise responsibility and authority in design decisions and exhibit exceptional customer service skills. As such, they demonstrate this by voluntarily keeping the (internal or external) customer updated regularly without being asked about the status. A Sr. Design Engineer is considered a reliable consultant by customers.

• Design Laminate (BGA) and Wafer Level packages, determining design rules, design optimization/verification, and selecting package type for thermal, mechanical, and electrical aspects
• Create detailed engineering drawings with no supervision
• Utilize skills and experience to solve design problems and customer issues
• Seek out opportunities to improve and advance design technology
• Exercise responsibility when making design-related decisions
• Create and sustain effective, productive, and quality partnerships between the design team and customers
• Interact with Amkor Product Group & Sales teams to ensure customer requirements are met; interface with internal and external customers as required
• Create documentation and perform record-keeping
• Lead by example while learning
• Other duties as assigned

Required Qualifications:

• A bachelor’s degree in Electrical Engineering, Mechanical Engineering, or other relevant engineering disciplines
• A minimum of 5 years of experience in a semiconductor environment
• Basic knowledge of transmission line theory and solid signal and power-integrity fundamentals
• Demonstrated experience using AutoCAD or equivalent software to create engineering drawings
• Expert level of understanding of package design tools and techniques (Cadence, AutoCAD, and Cam350)
• Excellent verbal and written communication skills
• The ability to efficiently complete tasks with minimal or no supervision
• Self-motivated and team-oriented with the ability to meet aggressive schedules and able to work well in a team environment

• Demonstrated understanding how to modify designs to improve performance is a plus
• Understands and implements cost-saving design techniques is desired
• Has an advanced understanding of supplier and assembly processes – and can make tradeoffs when needed is preferred
• Has an advanced understanding of SI/PI principles is a plus
• Experience using design simulation tools is desired
• Experience designing wafer-level packages using the L-Edit design tool is beneficial