Staff Engineer, Thermal Simulation

Amkor is recruiting for a Staff Thermal Simulation Engineer based in Tempe, AZ. The primary responsibility of this position is to perform thermal simulation and analysis for Integrated Circuit Packaging to support product development for Amkor’s internal and external customers. The applicant should have demonstrated skills in performing thermal analysis, running simulations, and analyzing data.

• Perform thermal simulation and analysis of Integrated Circuit packages in various conditions using software tools like Siemens Flotherm and Ansys Icepak, Mechanical, and MAPDL. Typical simulation scenarios include steady-state and transient analysis in the standard JEDEC environment, heat sink analysis, power map analysis, and compact model generation with model scope ranging from the device or component level to higher system level analysis.
• Work with business units and R&D to support customer product development, design optimization, and thermal solutions for mainstream and advanced packaging technologies to meet thermal requirements.
• Coordinate with R&D lab teams for validation of models and measurement results during material and test vehicle development projects.
• Effectively communicate with internal and external customers. Provide world class services to our customers.
• Develop and maintain current and new thermal analysis tools to improve productivity by expanding simulation team capabilities and automating common tasks.

Qualifications:

• BS degree in Mechanical Engineering.
• A minimum of 6 years of direct, relevant working experience in thermal engineering.
• Strong understanding of heat transfer mechanisms and the factors that affect component and system thermal performance and efficiency.
• Experience with thermal analysis tools such as Flotherm, Icepak, and/or other similar 3D multi-physics simulation tools.
• Demonstrated experience with one or more modern engineering coding or scripting languages such as Python or MATLAB.
• Effective verbal and written communication/presentation skills.
• Strong ability to work independently and drive schedules efficiently while maintaining a customer-service oriented focus.

• MS degree in Mechanical Engineering with a focus in heat transfer is a plus.
• Thermal test experience of electronic packages in a lab environment or in a manufacturing support role is desired.
• Knowledge of finite element analysis and computational fluid dynamics fundamentals and theory is preferred.
• Knowledge of semiconductor devices, packaging and materials is desired.
• Basic understanding of the use of code development environments (such as VS Code) and code version control tools and practices (such as Git) is a plus.
• Ability to work in a diverse work environment is preferred.