Arm
Arm has a great opportunity for a Package Design Engineer in our System-in-Package Integration team! You will work closely with IP, SoC Design, Package Design, Signal/Power Integrity and Systems teams throughout the company as well was interact with leading worldwide technology partners.
As we develop new system-level solutions for our world-class Arm IP ecosystems, packaging is a space where innovation is flourishing. This opportunity will focus on multichip systems where 2.xD and 3D approaches are necessary for optimizing performance.
The engineer will be responsible for the definition, design, and verification of package designs. Candidate will work closely with teams in France, US, UK, and other ARM locations on an as-needed basis. The candidate will interact with digital designers (P&R) on the inputs and constraints to build efficient designs, and also interact with SI/PI engineers. Clear communication with other team members is important.
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