Aftermarket sensors boost yield; SLM gains steam; thermal test challenges; AI impact on ATE; escape rates; shift left with ML; predictive modeling tools; gas analysis.
Tracking HW vulnerabilities; Radar, AI and autonomy IC design; cryptography's direction; AI accelerators decryption; USB4; GenAI in China; AI at the IoT edge; PQC; transmitting sensor data; battery power consumption; functional safety; SRAM PUF; noise prediction.
Special report on top-down vs. bottom-up chiplet design; generative EDA’s slow progress; AI for system design; RISC-V’s SW portability challenge; optimization issues; NoC soft tiling; HBM4; shift left LVS.
Special report on increasing HBM options for AI; FOPLP for advanced packaging; 3D vs. hybrid, monolithic integration; investments in EMEA & Asia; one chip vs. many chiplets; multi-chiplet package, test; etch uniformity; EUV pellicle.
Special report on transformative changes for chip design; managing power for AI; new AI data types; big changes ahead for analog design; MRDIMM; computational storage; multi-core sim; Rust; Intel vs. AMD; language models at the edge; chiplets and more.
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