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Home > Home > Category See More

Technical Paper Home

Technical Papers

  • Optimizing Oxide Interfaces To Preserve Device Performance in TMDC-based Transistors (imec, ETH Zurich)

    Published on March 17, 2026
  • 3D DRAM with CBA Technology (Georgia Tech)

    Published on March 16, 2026
  • Systematic Training and Validation of AI-based Systems With Digital Twins and Scenario Engineering

    Published on March 16, 2026
  • Pathfinding Method That Models ECC Overhead for Chiplet Interconnects (UCLA)

    Published on March 16, 2026
  • Neuromorphic Computing Platform In Perovskite Nickelates (UCSD, Rutgers)

    Published on March 11, 2026
  • FeFETs With Laminated Gate Stacks For Radiation Resilience in Vertical NAND (Georgia Tech)

    Published on March 10, 2026
  • Wafer-on-Wafer Hybrid Bonding: Reticle Placements To Achieve Efficient NW Topologies (ETH Zurich)

    Published on March 9, 2026
  • A Framework That Generates Chip Layouts Directly From Natural Language Specifications (U. of Bristol, RAL)

    Published on March 9, 2026
  • Unified, Traceable Framework For Risk Assessment in Automotive Semiconductors (Robert Bosch)

    Published on March 9, 2026
  • 10-Year Roadmap for AI + Hardware (UIUC, UCLA, Stanford et al.)

    Published on March 6, 2026
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