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• A Novel Tier Partitioning Method in 3DIC Placement Optimizing PPA

  Published on March 11, 2025

• Thermal-Aware DSE Framework for 3DICs, With Advanced Cooling Models

  Published on March 11, 2025

• Thermally Aware Chiplet Placement Algorithm Based on Automatic Differentiation (MIT, IBM)

  Published on March 7, 2025

• 4D mmWave Radar-Based Road Boundary Detection System

  Published on March 7, 2025

• The Optical Implementation of Backpropagation (Oxford, Lumai)

  Published on March 7, 2025

• Field-Coupled Nanocomputing: Scalable And Efficient Post-Layout Optimization (TU Munich)

  Published on March 7, 2025

• Solution To Read Disturbance For Current And Future DRAM Chips at Low Area, Performance And Energy Costs (ETH Zurich et al.)

  Published on March 7, 2025

• Understanding Fault Injection Attacks At The Pre-Silicon Level

  Published on March 7, 2025

• Effects Of Reduced Refresh Latency On RowHammer Vulnerability Of DDR4 DRAM Chips

  Published on March 4, 2025

• Wafer-Level Test Infrastructure for Higher Parallel Wafer Level Testing of SoC

  Published on March 3, 2025
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