Technical Paper Home

• Epitaxial Growth Of Up To 120 Si/SiGe Bilayers In View of 3D DRAM Applications (imec, Ghent Univ.)

  Published on August 5, 2025

• 3DICs: Atomic-Scale Behavior of Electromigration in Cu−Cu Joints (NYCU, ITRI)

  Published on August 5, 2025

• SpiNNaker2 Neuromorphic Platform: HW-Aware Fine-Tuning of Spiking Q-Networks (TU Dresden Et Al.)

  Published on August 5, 2025

• Optical Next-Gen Reservoir Computing Framework (Sorbonne, CNRS, Tsinghua U. et al)

  Published on August 5, 2025

• Double Intra-Cavity VCSELs: Properties And Design Challenges At Cryogenic Temperatures (Tampere Univ.)

  Published on August 5, 2025

• Non-ideal Subthreshold Swing In Aligned CNTs Due To Variable Occupancy Discrete Charge Traps (Berkeley Lab, Sandia)

  Published on August 5, 2025

• Framework To Control And Interact With SystemC-based Virtual Platforms Using The FMI (RWTH Aachen Univ. et al.)

  Published on August 5, 2025

• Issues In Ramping Advanced Packaging

  Published on August 5, 2025

• Chip Industry Technical Paper Roundup: August 5

  Published on August 5, 2025

• Research Bits: August 5

  Published on August 5, 2025
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