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Technical Paper Home

Technical Papers

  • Analog In-Memory Computing: Fast Deep NN Training (IBM Research)

    Published on September 10, 2024
  • Flip-Chip Bonding Technique To Excite LN Resonators Via Noncontact Electrodes (Yale)

    Published on September 9, 2024
  • Fano Resonance in a Si PIC Using a Piezoelectrically Driven Mechanism (Ghent, imec)

    Published on September 6, 2024
  • New Strategies For Enhancing Transport Properties of Conducting Polymers (Cambridge, et al.)

    Published on September 6, 2024
  • Microfluidic Cooling Design For Hotspots in Thermal Design Power Chips (Corintis)

    Published on September 4, 2024
  • Scalable Chiplet System for LLM Training, Finetuning and Reduced DRAM Accesses (Tsinghua University)

    Published on September 4, 2024
  • ECTC 2024 Session Readout: Advancement of Metrology

    Published on September 4, 2024
  • Cooling Technology For Next Gen Power Electronics

    Published on September 4, 2024
  • Large-Scale VFETs With Ultra-Short Channel Length And High Performance

    Published on September 4, 2024
  • Hardware Security: One-Key Premise of Logic Locking

    Published on August 30, 2024
    • Page 27 of 153
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