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Technical Paper Home

  • How Gamification Improves Semiconductor IP Reuse

    Published on February 20, 2023
  • Process Innovations Enabling Next-Gen SoCs and Memories

    Published on February 20, 2023
  • Measuring 3D Sidewall Topography & LER for Photoresist Patterns Using Tip-Tilting AFM Technology

    Published on February 19, 2023
  • HW-SW Co-Design Solution For Building Side-Channel-Protected ML Hardware

    Published on February 19, 2023
  • HBM-Enabled FPGA-Based Graph Processing Accelerator

    Published on February 19, 2023
  • Week In Review: Semiconductor Manufacturing & Test

    Published on February 17, 2023
  • Week In Review: Design, Low Power

    Published on February 17, 2023
  • Week In Review: Auto, Security, Pervasive Computing

    Published on February 17, 2023
  • Review of Tools & Techniques for DL Edge Inference

    Published on February 16, 2023
  • Looking Forward To SPIE, And Beyond

    Published on February 16, 2023
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