Technical Paper Home

Technical Papers

• Examination Of Thermal Issues Related to Hybrid Bonding of 3D-Stacked HBM

  Published on July 16, 2025

• Volatile And Non-Volatile NEM Switches Fabricated In A CMOS-Compatible SOI Foundry Platform (KTH, U. of Bristol, EPFL, Imec)

  Published on July 16, 2025

• Physics-Based ASICs (Normal Computing et al.)

  Published on July 15, 2025

• Analysis of RISC-V CPU Fuzzers via Automatic Bug Injection (ETH Zurich)

  Published on July 15, 2025

• Three Methods For Improving Planarization For Diverse Layouts In Advanced Nodes (Fraunhofer IPMS)

  Published on July 14, 2025

• Photonic SRAM Facilitating Electro-Optic Data Storage For Ultra-Fast IMC (UW-Madison, USC)

  Published on July 14, 2025

• Co-Designing Data Center Architecture To Support LLMs (Intel, Georgia Tech)

  Published on July 14, 2025

• GAA Transistors: 3D Atomic-Scale Metrology of Strain Relaxation and Roughness via Electron Ptychography (Cornell, ASM, TSMC)

  Published on July 14, 2025

• Colloidal Coordination Nanosheets, And Their Use as Inks For Coating (Tokyo University of Science)

  Published on July 11, 2025

• Emerging NVM: Review Of Emerging Memory Materials And Device Architectures

  Published on July 8, 2025
Page 38 of 194
• « First
• ‹ Previous
• 34
• 35
• 36
• 37
• 38
• 39
• 40
• 41
• 42
• Next ›
• Last »