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Technical Paper Home

Technical Papers

  • Characterizing and Evaluating A Quantum Processor Unit In A HPC Center

    Published on June 10, 2024
  • Device Characteristics of GAA-Structured CMOS and CTFET Under Varying Temperatures

    Published on June 10, 2024
  • Efficient TNN Inference on RISC-V Processing Cores With Minimal HW Overhead

    Published on June 10, 2024
  • Adoption of Chiplet Technology in the Automotive Industry

    Published on June 10, 2024
  • Comparing Thermal Properties In Molybdenum Substrate To Si And Glass For A System-On-Foil Integration (RIT, Lux)

    Published on May 31, 2024
  • Using Formal Verification To Evaluate The HW Reliability Of A RISC-V Ibex Core In The Presence Of Soft Errors

    Published on May 31, 2024
  • CAM-Based CMOS Implementation Of Reference Frames For Neuromorphic Processors (Carnegie Mellon U.)

    Published on May 31, 2024
  • Physics-Based Digital Twin of a Thermally Aged Flip-Chip Package (TU Delft, NXP)

    Published on May 29, 2024
  • Properties of Commercially Available Hexagonal Boron Nitride Grown By The CVD Method

    Published on May 29, 2024
  • CMOS ICs for 77 GHz Automotive Radar

    Published on May 28, 2024
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