Technical Paper Home

Lithography

• ASD process that was performed in situ on the etch chamber

  Published on May 6, 2022

• Stress tensor mesostructures for deterministic figuring of thin substrates

  Published on April 21, 2022

• Source performance metrics for EUV mask inspection

  Published on April 18, 2022

• Review of essential use of fluorochemicals in lithographic patterning and semiconductor processing

  Published on April 6, 2022

• Investigation of the Resistivity and Emissivity of a Pellicle Membrane for EUV Lithography

  Published on April 1, 2022

• Pushing the limits of EUV mask repair: addressing sub-10 nm defects with the next generation e-beam-based mask repair tool

  Published on December 7, 2021

• International Roadmap for Devices and Systems lithography roadmap

  Published on November 19, 2021

• High-NA EUVL: the next major step in lithography

  Published on October 5, 2021

• Inverse lithography technology: 30 years from concept to practical, full-chip reality

  Published on October 1, 2021

• Extremely Large Exposure Field w/Fine Resolution Lithography Tech To Enable Next-Gen Panel Level Advanced Packaging

  Published on August 5, 2021
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