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Technical Paper Home

Memory

  • Recent Advances and Challenges in Processing-in-DRAM (ETH Zurich)

    Published on December 30, 2024
  • 2D Ferroelectric Field-Effect Transistors (Penn State, U. of Minnesota)

    Published on December 30, 2024
  • Advancements in SOT-MRAM Device Development (imec)

    Published on December 28, 2024
  • CXL’s Potential to Elevate The Capabilities of HPC and AI Applications (Micron, Intel)

    Published on December 20, 2024
  • Nonvolatile Electrochemical Memory Cell For Temperatures Up To 600°C (U. Of Michigan, Sandia)

    Published on December 18, 2024
  • Promising Materials Beyond Silicon (TI, AIXTRON, imec)

    Published on December 3, 2024
  • STCO for Dense Edge Architectures using 3D Integration and NVM (imec,, et al.)

    Published on November 27, 2024
  • Pooling CPU Memory for LLM Inference With Lower Latency and Higher Throughput (UC Berkeley)

    Published on November 26, 2024
  • Monitor Etch Defects on Dies in the Outer Regions Of The Wafer Using ISR

    Published on November 26, 2024
  • Distributed Shared Memory That Enlarges Effective Memory Capacity Through Intelligent Tiered DRAM and Storage Management (IIT)

    Published on November 13, 2024
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