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JEDEC

Standards related to electronic systems and components
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Description

Back in the early days of electronics, when valves were still more prevalent than transistors, the industry needed a way to consistently number tubes. The Radio Manufacturers Association (which later became the Electronic Industries Association) and the National Electronic Manufacturers Association established the Joint Electron Tube Engineering Council (JETEC) so perform just that function. When semiconductor devices started to appear, a similar organization was required – the Joint Electron Device Engineering Council (JEDEC). From those early days in 1958, JEDEC has significantly expanded its scope and has become a standards body with a number of notable achievements including specifications for computer memory, ranging from dynamic RAM chips and memory modules to DDR synchronous DRAM and flash components. In the manufacturing area, JEDEC produced standards, publications and educational events addressing the migration to lead-free manufacturing processes.
In 2011, JEDEC published 29 complete standards, 3 publications, 9 registered outlines, 3 design guides, 11 memory device specifications, and 6 design files, including the following:
JESD220, Universal Flash Storage
JESD84-B45, Embedded Multi-Media Card (e•MMC), Electrical Standard (4.5 Device)
JESD79-3-2, Addendum No. 2 to JESD79-3
JESD9B, Inspection Criteria for Microelectronic Packages and Covers
JESD216, Serial Flash Discoverable Parameters (SFDP) for Serial NOR Flash
JS709, Joint JEDEC/ECA Standard, Defining ‘Low-Halogen’ Passives And Solid State Devices (Removal of BFR/CFR/PVC)
JS-001-2011, Joint ANSI/ESDA/JEDEC Standard For Electronic Discharge Sensitivity Test – Human Body Model (HBM) Component Level
JEP144A, Guideline For Internal Gas Analysis For Microelectronic Packages
MO-303A, Registration – Land Grid Array Family, Rectangular, 0.50 mm Pitch
SPD4_01_02_11 Release No. 21A SPD Annex K – Serial Presence Detect (SPD) for DDR3 SDRAM Modules

In 2012, JEDEC published 19 complete standards, 3 publications, 4 joint standards, 17 registered outlines, 2 design registrations, and 6 memory device specifications, including the following:
JESD79-4, DDR4 SDRAM Standard
JESD229, Wide I/O Single Data Rate
JESD51-x Series (-50,-51,-52 and -53), the first international thermal testing standards for LEDs
JESD209-3, Low Power Double Data Rate 3 SDRAM (LPDDR3)
JESD230, NAND Flash Interface Interoperability
JEDEC also published the following notable updates to previously existing standards:
JESD84-B451, Embedded Multi-Media Card (e•MMC), Electrical Standard (4.51)
JESD220A, Universal Flash Storage (UFS 1.1)
JESD219A, Solid State Drive (SSD) Endurance Workloads
J-STD-033C, Joint IPC/JEDEC Standard for Handling, Packing, Shipping, and Use of Moisture/Reflow Sensitive Surface-Mount Devices

In 2013, JEDEC published 20 complete standards, 5 publications, 2 joint standards, 15 registered outlines, 2 design registrations, and 8 memory device specifications, including the following:

JESD220-1, Universal Flash Storage (UFS), Unified Memory Extension
JESD223-1, Universal Flash Storage Host Controller Interface (UFSHCI), Unified Memory Extension
JESD224, Universal Flash Storage (UFS) Test
JESD226, RF Biased Life (RFBL) Test
JESD234, Test Standard for the Measurement of Proton Radiation Single Event Effects in Electronic Devices

JEDEC also published the following notable updates to previously existing standards:

JESD84-B50, Embedded Multi-Media Card (e•MMC), Electrical Standard (MMCA 5.0)
JESD88E, Dictionary of Terms for Solid-State Technology
JESD212B, Graphics Double Data Rate (GDDR5) SGRAM Standard
JESD220B, Universal Flash Storage (UFS 2.0)
JESD223B, Universal Flash Storage Host Controller Interface (UFSHCI)
JESD230A, NAND Flash Interface Interoperability

  • HQ: Arlington, VA, USA
  • Known for: Standards, DDR, LPDDR, Wide IO, memory, interfaces
  • Web: URL
  • Other names: Joint Electron Device Engineering Council
  • Type: Standards Group

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