Edge And IoT Security Turning A Corner


Security is beginning to improve for a wide range of IoT and edge devices due to better tools, the implementation of new standards and methodologies, and an increasing level of collaboration and communication across different market segments that in the past had little or no interaction. Until recently, many vendors in cost-sensitive markets offered the bare minimum of security. To make matt... » read more

Matter 1.4 Advancements In The Smart Home


Recently the Connectivity Standards Alliance (CSA) announced the updated Matter 1.4 specification.  This new release shows the smart home business community's continued discipline in maintaining this release schedule for developers and manufacturers as Matter adoption grows and becomes more successful in the smart home space. This update includes normal bug fixes,  multiple feature enhance... » read more

RISC-V Profiles Help Conformance


Experts At The Table: What's needed to be able to trust that a RISC-V implementation will work as expected across multiple designs using standard OSes. Semiconductor Engineering discussed the issue with John Min, vice president of customer service at Arteris; Zdeněk Přikryl, CTO of Codasip; Neil Hand, director of marketing at Siemens EDA (at the time of this discussion); Frank Schirrmeist... » read more

Barriers To Chiplet Sockets


Experts At The Table: Demand for chiplets is growing, but debate continues about whether standards and general-purpose chiplets will kick-start the commercialization boom, or whether success will come through customization of those chiplets. Semiconductor Engineeering sat down to discuss these and other related issues with Elad Alon, CEO of Blue Cheetah; Mark Kuemerle, vice president of technol... » read more

Enabling Innovative Multi-Vendor Chiplet-Based Designs


Chiplets have emerged as a critical implementation paradigm for semiconductor products, primarily because they can deliver cost benefits relative to a non-chiplet-based approach. The first, most well-proven, and obvious benefit of a chiplet-based approach is manufacturing cost. Manufacturing cost benefits are accrued either from the appropriate selection of chiplet die size, or by optimizin... » read more

Devising Security Solutions For Hardware Threats


Experts At The Table: Hardware security has evolved considerably in recent years, but getting products to market is a challenge in an environment where threats are always evolving and rarely predictable. That’s especially true given the sheer volume and variety of products being introduced. Semiconductor Engineering sat down with a panel of experts at the Design Automation Conference in San F... » read more

What Comes After HBM For Chiplets


Experts At The Table: Semiconductor Engineering sat down to discuss what will trigger the creation of a commercial chiplet marketplace, and what those chiplet-based designs will look like, with Elad Alon, CEO of Blue Cheetah; Mark Kuemerle, vice president of technology at Marvell; Kevin Yee, senior director of IP and ecosystem marketing at Samsung; Sailesh Kumar, CEO of Baya Systems; and Tanuja... » read more

Standardizing Defect Coverage In Analog/Mixed Signal Test


A newly drafted IEEE standard will bring more consistency to defect metrics in analog/mixed (AMS) designs, a long-overdue step that has become too difficult to ignore in the costly heterogeneous assemblies being deployed inside of data centers and mobile devices. Standardizing analog is no simple feat due to the legacy approach to AMS design, and this is not the first attempt at improving te... » read more

Hardware Security Set To Grow Quickly


Experts At The Table: The hardware security ecosystem is young and relatively small but could see a major boom in the coming years. As companies begin to acknowledge how vulnerable their hardware is, industry standards are being set, but must leave room for engineers to experiment. As part of an effort to determine the best way forward, Semiconductor Engineering sat down with a panel of experts... » read more

Digital Twins Find Their Footing In IC Manufacturing


Momentum is building for digital twins in semiconductor manufacturing, tying together the various processes and steps to improve efficiency and quality, and to enable more flexibility in the fab and assembly house. The movement toward digital twins opens up a slew of opportunities, from building and equipping new fabs faster to speeding yield ramps by reducing the number of silicon-based tes... » read more

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