tag: standards

Need To Share Data Widens In IC Manufacturing
By Ed Sperling - 31 Aug, 2023 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss issues in smart manufacturing of chips, including data management and grounding, chiplets, and standards, with Mujtaba Hamid, general manager for product management for secure cloud environments at Microsoft; Vijaykishan Narayanan, vice president and general manager of India engineering and operations at proteanTecs; KT Moore,... » read more

Week In Review: Design, Low Power
By Linda Christensen - 25 Aug, 2023 - Comments: 0

Arm filed its registration statement for a highly anticipated IPO. Chip industry heavyweights Apple, Samsung, NVIDIA, and Intel are all expected to invest. Find the SEC filing here. Taiwan’s National Science and Technology Council (NSTC) laid out a 10-year initiative to bolster its IC design market share to 40% worldwide by 2033, with the first year’s budget of US $376 million. The sh... » read more

Preparing For Commercial Chiplets
By Ed Sperling - 24 Aug, 2023 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss the path to commercialization of chiplets with Saif Alam, vice president of engineering at Movellus; Tony Mastroianni, advanced packaging solutions director at Siemens Digital Industries Software; Mark Kuemerle, vice president of technology at Marvell; and Craig Bishop, CTO at Deca Technologies. What follows are excerpts of tha... » read more

Curbing Automotive Cybersecurity Attacks
By John Koon - 06 Jul, 2023 - Comments: 1

The relentless cyberattacks on the automotive sector are not limited to vehicles and have an impact on the entire automotive supply chain, so the pressure is on the automotive ecosystem to understand the necessary standards and regulations for vehicles and components. While the process of attaining compliance adds additional effort, in the long run, the increase in cybersecurity will save the a... » read more

Optimizing Scan Test For Complex ICs
By Gregory Haley - 09 May, 2023 - Comments: 0

As chips become more heterogeneous with more integrated functionality, testing them presents increasing challenges — particularly for high-speed system-on-chip (SoC) designs with limited test pin availability. In addition, the complexity of emerging packages like 3D and chiplets necessitates comprehensive new solutions that can provide faster results at multiple stages in the silicon lifec... » read more

How Safe Is Safe Enough?
By Frank Schirrmeister - 04 May, 2023 - Comments: 1

That was the overarching question a group of 180 experts discussed last week at the ISO 26262 & SOTIF conference for four days during #FuSaWeek2023 in Berlin. "How Safe is Safe Enough" is also the title of Prof. Koopman's book from September 2022. I mentioned him in my blog "Are We Too Hard On Artificial Intelligence For Autonomous Driving?" Prof. Koopman was referenced often in Berlin, and... » read more

What’s Next In Wireless Standard Adoption?
By Chen Chang - 27 Apr, 2023 - Comments: 0

By Chen Chang and Alejandro Escobar Calderon Although each generation in wireless technologies often introduces enhanced capabilities, the broad adoption of any new technology requires both technical and business viability. For 5G, solving for technical challenges such as path loss and radio front-end efficiency has led to massive innovations in network design, semiconductor packaging, and t... » read more

Chiplets: More Standards Needed
By Andy Heinig - 13 Apr, 2023 - Comments: 1

Recent months have seen new advances in chiplet standardization. For example, consortia such as Bunch of Wires (BoW) and Universal Chiplet Interconnect Express (UCIe) have made progress in developing standards for die-to-die (D2D) interfaces in a chiplet’s design. Far from being a new phenomenon in communication, these types of standards are established for all forms of wired and wireless com... » read more

Chiplet Security Risks Underestimated
By Ann Mutschler - 06 Apr, 2023 - Comments: 0

The semiconductor ecosystem is abuzz with the promise of chiplets, but there is far less attention being paid to security in those chiplets or the heterogeneous systems into which they will be integrated. Disaggregating SoCs into chiplets significantly alters the cybersecurity threat landscape. Unlike a monolithic multi-function chip, which usually is manufactured using the same process tech... » read more

Growing Challenges For Increasingly Connected Vehicles
By John Koon - 06 Apr, 2023 - Comments: 0

Automobiles will become increasingly connected over the next decade, but that connectivity will come at a price in terms of dollars, security, and constantly changing technology. Connectivity involves all parts of a vehicle. It includes everything from autonomous driving to in-cabin monitoring and connected infotainment. And it encompasses external sensors, IoT, V2X, over-the-air communicati... » read more

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