Andy Heinig

  (all posts)
Andy Heinig is group leader for advanced systems integration and department head for efficient electronics at Fraunhofer Institute of Integrated Circuits, Division of Engineering and Adaptive Systems.

Author's Latest Posts

Current And Future Challenges For An Open Chiplet Ecosystem
By Andy Heinig - 14 Mar, 2024 - Comments: 0

There are currently a variety of ways to approach chiplet systems. One is to have a closed system in which a manufacturer develops all the components in-house and is also in charge of commissioning and overseeing assembly. In this scenario, everything is coordinated within that company and no standards are required. Another is to establish open chiplet systems. This approach taps a considera... » read more

Chiplets: More Standards Needed
By Andy Heinig - 13 Apr, 2023 - Comments: 1

Recent months have seen new advances in chiplet standardization. For example, consortia such as Bunch of Wires (BoW) and Universal Chiplet Interconnect Express (UCIe) have made progress in developing standards for die-to-die (D2D) interfaces in a chiplet’s design. Far from being a new phenomenon in communication, these types of standards are established for all forms of wired and wireless com... » read more

Edge AI And Chiplets
By Andy Heinig - 08 Dec, 2022 - Comments: 0

In the near future, more edge artificial intelligence (AI) solutions will find their way into our lives. This will be especially true in the private sector for applications in the field of voice input and analysis of camera data, which will become well-established. These application areas require powerful AI hardware to be able to process the corresponding continuously accumulating data volumes... » read more

Chiplets: Current Status
By Andy Heinig - 12 May, 2022 - Comments: 0

Recent weeks have seen a number of interesting developments in the area of chiplets. An increasing number of products based on chiplets have been brought to market, especially in the processors segment. For example, Apple and AMD now have processors with chiplets on the market and under production in high volumes. On one hand, this means that sufficient production capacity has now been built up... » read more

Chiplets: A Solution For The Shortage Of Chips
By Andy Heinig - 13 May, 2021 - Comments: 1

These days, there are new reports on the shortage of chips almost every day. Currently, this issue is affecting mainly car manufacturers such as Audi, Ford, and more. But other system manufacturers, such as in the machine construction industry, are also facing this challenge. Even manufacturers of mass-produced articles such as game consoles are reporting the same problems. The problem is sure ... » read more

Electronics For Quantum Communications
By Andy Heinig - 12 Nov, 2020 - Comments: 1

Our secure digital communications so far have functioned on the principle of key-based encryption. This involves generating a key of appropriate length, which is then used to encrypt the data. Because distributing the keys is difficult, the keys are reused rather than regularly generating new ones. The regular use of the keys opens up the encryption process to attacks by mathematical methods... » read more

Packaging And Package Design For AI At The Edge
By Andy Heinig - 12 Mar, 2020 - Comments: 0

Industrial applications will acquire significantly more data directly from machines in coming years. To properly handle this increase in data, it must already be prepared at the machine. The data of the individual sensors can be processed, or an initial data merger can take place here at the so-called “edge.” Algorithms and methods from the field of artificial intelligence increasingly a... » read more

Driving With Chiplets
By Andy Heinig - 24 Sep, 2019 - Comments: 0

The first examples of the upper class of vehicles that can drive autonomously on the highway already have arrived on the market or will be introduced to the market in the coming years. Travel on the highway was selected as the first application because the number of objects that have to be taken into account in front of, next to, and behind the vehicle is manageable. This means the required ... » read more

Interaction Of Hard IP And Chip-Package
By Andy Heinig - 08 Nov, 2018 - Comments: 0

Current and future customer-specific circuit development requires an increasing number of different interfaces, such as for memory (DDR3, DDR4, LPDDR3, LPDDR4, etc.), radio interfaces (Bluetooth, NBIoT, etc.) or high-speed LVDS/SERDES interfaces (DisplayPort, Ethernet, USB, etc.). For customer-specific circuit projects, these components are frequently purchased as hard IP because the developmen... » read more

Why Use An Assembly Design Kit And Assembly Design Flow?
By Andy Heinig - 08 Feb, 2018 - Comments: 0

A number of years ago, the packages of electronic systems were only intended to protect the circuit from mechanical stresses and to realize a simple fan-out from the close spacing of connections on the circuit to the larger spacing on the packaging. At the time, there were also only a few different packaging types, all of simple design. Over the years, however, the requirements on packages have... » read more

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