Uniquely Identifying PCBs, Subassemblies, And Packaging


Securing the semiconductor supply chain is becoming much more difficult as devices increasingly are disaggregated, a shift being forced on the industry due to the rising cost of scaling and the need for more customization and faster time to market. Individual component IDs are an important starting point for supply chain trust, but they are no longer sufficient. Those components will end up ... » read more

Design For Manufacturing Best Practices


Manufacturing issues are one of the top reasons that we see warranty returns and loss of market share in the electronics industry. Issues like supply chain failures and printed circuit board assembly (PCBA) production challenges related to design can lead to irreparable damage to a brand’s reputation. It is therefore critical that companies have a design for manufacturability (DfM) protocol i... » read more

112G SerDes Reliability


Priyank Shukla, product marketing manager at Synopsys, digs into 112Gbps SerDes, why it’s important to examine the performance of these devices in the context of a system, what is acceptable channel loss, and how density can affect performance, power and noise. » read more

Industry Pushes For Fab Tool Security Standards


The semiconductor industry is developing new cybersecurity standards for fab equipment in an effort to protect systems from potential cyberattacks, viruses, and IP theft. Two new standards are in the works, which are being formulated under the auspices of the SEMI trade group with leadership from chipmakers and others. Led by Intel and Cimetrix, the first standard deals with malware-free equ... » read more

Wireless Power Market Heats Up


The wireless power market is in flux as established technologies meet newer approaches. Old standards battles have simmered somewhat, but competing messages remain. What the public ends up using will depend heavily on public charging infrastructure, but the stakes are significant. The market for battery chargers is forecast to reach $25B by 2022. Most of those chargers plug into the wall, bu... » read more

Accellera Tackles Functional Safety


During DAC, Accellera had a workshop about functional safety. In case you don't know, Accellera has a relatively new working group (WG) on Functional Safety. The chair is Cadence's Alessandra Nardi, who coincidentally also received the Marie Pistilli Award for Women in EDA during DAC (you can read more about that in my post Alessandra Nardi Receives Marie Pistilli Award for Women in EDA). But ... » read more

Universal Verification Methodology Running Out Of Steam


For the past decade or so, the Universal Verification Methodology (UVM) has been the de facto verification methodology supported by the entire EDA industry. But as chips become more heterogeneous, more complex, and significantly larger, UVM is running out of steam. Consensus is building that some fundamental changes are required, moving tools up a level of abstraction and making them more ag... » read more

Open-Source Verification


Ask different people what open-source verification means and you will get a host of different answers. They range from the verification of open-source hardware, to providing an open-source verification infrastructure, to providing open-source stream generators or reference models, to open-source simulators and formal verification engines. Verification is about reducing risk. "Verification is... » read more

Challenges For A Post-Moore’s Law World


Semiconductor Engineering sat down to discuss challenges at the edge, the impact of open-source, and how to attract new talent, with Simon Segars, CEO of Arm; Joseph Sawicki, executive vice president of IC EDA at Mentor, a Siemens Business; Raik Brinkmann, CEO of OneSpin Solutions; Babak Taheri, CEO of Silvaco; John Kibarian, CEO of PDF Solutions; and Prakash Narain, CEO of Real Intent. The con... » read more

Data Becomes Key For Next-Gen Chips


Data has become vital to understanding the useful life of a semiconductor — and the knowledge gleaned is key to staying competitive beyond Moore’s Law. What's changed is a growing reliance earlier in the design cycle on multiple sources of data, including some from further right in the design-through-manufacturing flow. While this holistic approach may seem logical enough, the semiconduc... » read more

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