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Enabling Test Strategies For 2.5D, 3D Stacked ICs


Improved testability, coupled with more tests at more insertion points, are emerging as key strategies for creating reliable, heterogeneous 2.5D and 3D designs with sufficient yield.  Many changes need to fall into place to make side-by-side 2.5D and 3D stacking approaches cost-effective, particularly for companies looking to integrate chiplets from different vendors. Today, nearly all of t... » read more

Where Are The Autonomous Cars?


Are we there yet? Governments, consumers, and engineers alike want to know how close the automotive world is to producing a fully autonomous Level 5 vehicle. While some experts say such vehicles could hit the road in the next few years, they're a shrinking minority. Most forecasts say a truly self-driving car is at least a decade away — and maybe much longer, because it requires disruptive... » read more

Building Trust Through Certification Of Security Solutions


Certification is all around us in our daily lives. When it comes to making decisions, we look for certain labels, stamps, and symbols indicating that products and services have been assessed or tested. If you are buying a new car, you may review NCAP (New Car Assessment Program) test results. If you are getting electrical work done at your home, you will choose a certified professional. And if ... » read more

Is Standardization Required For Security?


Semiconductor Engineering sat down to discuss chip and system security with Mike Borza, fellow and scientist on the security IP team at Synopsys; Lee Harrison, automotive IC test solutions manager at Siemens Digital Industries Software; Jason Oberg, founder and CTO of Cycuity (formerly Tortuga Logic); Nicole Fern, senior security analyst at Riscure; Norman Chang, fellow and CTO of the electroni... » read more

Finding Frameworks For End-To-End Analytics


End-to-end analytics can improve yield and ROI on tool purchases, but reaping those benefits will require common data formats, die traceability, an appropriate level of data granularity — and a determination of who owns what data. New standards, guidelines, and consortium efforts are being developed to remove these barriers to data sharing for analytics purposes. But the amount of work req... » read more

Audio, Visual Advances Intensify IC Design Tradeoffs


A spike in the number of audio and visual sensors is greatly increasing design complexity in chips and systems, forcing engineers to make tradeoffs that can affect performance, power, and cost. Collectively, these sensors generate so much data that designers must consider where to process different data, how to prioritize it, and how to optimize it for specific applications. The tradeoffs in... » read more

Khronos: Open Standards Powering The Future Of Embedded Vision


At the recent Embedded Vision Summit, one of the presentations was by Neil Trevett of The Khronos Group. This is a standardization body and is a non-profit. He said that his day job is at Nvidia. It has been creating standards for 20 years with a focus on low-level hardware acceleration APIs for 3D graphics, parallel computation, augmented reality (AR), virtual reality (VR), and machine learnin... » read more

Bridging IC Design, Manufacturing, And In-Field Reliability


Experts at the Table: Semiconductor Engineering sat down to talk about silicon lifecycle management and how that can potentially glue together design, manufacturing, and devices in the field, with Prashant Goteti, principal engineer at Intel; Rob Aitken, R&D fellow at Arm; Zoe Conroy, principal hardware engineer at Cisco; Subhasish Mitra, professor of electrical engineering and computer sci... » read more

Chiplets: Current Status


Recent weeks have seen a number of interesting developments in the area of chiplets. An increasing number of products based on chiplets have been brought to market, especially in the processors segment. For example, Apple and AMD now have processors with chiplets on the market and under production in high volumes. On one hand, this means that sufficient production capacity has now been built up... » read more

Better Video Compression


Video data is increasing, but bandwidth is not increasing quickly enough. One solution is to compress that data, but the challenge is to do that without impacting resolution. Rob Green, AMD’s senior manager for Pro AV, Broadcast & Consumer, talks about what’s changing in video compression, from new standards to better analytics, virtualization, what impact AR/VR will have, and a compari... » read more

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