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MonolithIC 3D Inc

IC technology that enables vertical construction of chips
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Description

MonolithIC 3D’s technologies offer chipmakers a way to create semiconductor chips in vertical stacks of circuit elements that they believe delivers a rich vertical connectivity 10,000 times better than the existing TSV based 3D stacking. The company’s technologies have the potential to increase device speed, lower power requirements, reduce silicon area, and be cost competitive with traditional dimensional scaling.

  • HQ: San Jose, CA, USA
  • Known for: Monolithic 3D,IC,
  • Web: URL
  • Type: Company