Optimal Corporation offered 3D power, signal, and thermal integrity analysis for IC package, system-in-package, and PCB design. The company’s products included PakSi-E, a 3D quasi-static electromagnetic simulation tool for electronic packaging; PakSi, which determined the thermal and mechanical characteristics of the IC package before a design wascommitted to fabrication; O-Wave, a full-wave 3D EM analysis solution that allowed engineers to perform signal integrity analysis for IC package, System-in-Package (SiP), and PCB designs and PowerGrid, a suite of both DC and AC power integrity tools for IR drop and ground bounce analysis for IC packages and printed circuit boards.
