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Optimal Corporation

3D power, signal, and thermal analysis for package, System-in-Package (SiP), and board designs
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Description

Optimal Corporation offered 3D power, signal, and thermal integrity analysis for IC package, system-in-package, and PCB design. The company’s products included PakSi-E, a 3D quasi-static electromagnetic simulation tool for electronic packaging; PakSi, which determined the thermal and mechanical characteristics of the IC package before a design wascommitted to fabrication; O-Wave, a full-wave 3D EM analysis solution that allowed engineers to perform signal integrity analysis for IC package, System-in-Package (SiP), and PCB designs and PowerGrid, a suite of both DC and AC power integrity tools for IR drop and ground bounce analysis for IC packages and printed circuit boards.

  • Founded by: An-Yu Kuo in 1995
  • HQ: San Jose, CA, USA
  • Known for: power analysis, signal integrity, thermal analysis
  • Type: Company