New SE eBook examines the next phase of semiconductor design, testing, and manufacturing.
Multi-die assemblies offer more flexibility, but figuring out the right amount of customization can have a big impact on power, performance, and cost.
TSMC’s technology roadmap; Intel cuts; reciprocal hacking; McKinsey on IC challenges, ML algorithm table; subsystem chiplets; cross-domain PLM; magnetic switches; sarin sensors.
AI cannot optimize unless it can measure progress towards goals, but defining those goals is not easy, especially when looking at the entire development flow.
TSMC, ASML earnings; 2nm processor; HBM4; touch controllers for foldable OLED displays; $500B AI supercomputer buildout; NVIDIA, AMD export licenses; Cadence’s acquisition; DRAM, NAND flash; rare earths dry up; new EV chips.
