AI chips and data center communications see big funding; 75 startups raise $2 billion.
New SE eBook examines the next phase of semiconductor design, testing, and manufacturing.
Can we model the chip development flow so AI could optimize it?
Tariff questions, impact; global sales report; Europe’s chiplets focus; DARPA’s quantum push; Intel 18A enters risk production; optical networking bonanza; new wafer probe test; inference benchmark results; UMC opens 22nm fab in Singapore.
Multi-die assemblies offer more flexibility, but figuring out the right amount of customization can have a big impact on power, performance, and cost.
