EDA export controls; Synopsys-Ansys divest requirements; SIA Factbook; McKinsey effects of tariffs; ASE’s fan-out bridge; earnings; TSMC’s design center; China’s legacy chips play; AMD’s optical acquisition.
IC, AI global ranking; China’s fully automated IC design system; Micron goes bigger; PCIe 7.0 spec; TSMC-Tokyo joint lab; panel-level packaging win; first neuromorphic compute system; GAA forksheets; AMD’s new GPUs.
Does the world need another CPU architecture when that no longer reflects the typical workload? Perhaps not, but it may need a bridge to get to where it needs to be.
But blazing fast data speeds come with significant manufacturing challenges.
Qualcomm to buy Alphawave; reworking chip grants; global semi, equipment sales up; GF’s $16B expansion; Arm’s AI-defined vehicles platform; Mexico’s push; DRAM/DDR4; AI-powered RF design; MLPerf results; rare earths/magnets slow automakers; BEOL thermal resistance in BPD and chiplets.
