Fab tools are being fine-tuned for TSV processes as demand ramps for everything from HBM to integrated RF, power, and MEMS in 3D packaging.
Next-gen EUV laser R&D; $285M CHIPS Act award; U.S. microelectronics research centers; Synaptics-Google deal; maskless microLED DUV; Micron’s $2B fab expansion; Tesla sales slump; USB-C mandate in Europe.
Heterogenous integration is pushing chip and package designers to consider multi-physics effects as early as the initial architectural planning stage; new tools may be needed.
Variability is a growing challenge; achieving higher yields requires even tighter control and precision.
