Showing all 5 results
Higher density, heat, and more materials make it harder to ensure reliability.
Applied Materials’ $4B facility at risk; AI chip bonanza; Japan, U.S. alliance; Rapidus’ U.S. subsidiary; EDA revenue up; TSMC $6.6B funding; Infineon, Amkor team up; S. Korea’s big bet; Apple’s processor overhaul; high-NA EUVL defect system; chiplet HW security module; new Spectre attack.
Not all chiplets are interchangeable, and options will be limited.
Data center IC designs are evolving, based on workloads, but making the tradeoffs for those workloads is not always straightforward.
System design, large-scale simulations, and AI/ML could open multi-trillion-dollar markets for tools, methodologies, and services.