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Communication/Data Movement

• Two Silicon Switches Driven Both Thermally and Electrically With Ultra-Low-Crosstalk (Cambridge)

  Published on November 6, 2024

• CXL-Based Heterogeneous Systems: How to Optimize and Future Directions (UCSD, Samsung, SK Hynix)

  Published on November 6, 2024

• Visualization of Photoexcited Charges Moving Across the Interface of Si/Ge

  Published on November 5, 2024

• Workload-Specific Data Movements Across AI Workloads in Multi-Chiplet AI Accelerators

  Published on November 4, 2024

• Method To Determine The Permittivity of Dielectric Materials in 3D Integrated Structures At Broadband RF Frequencies

  Published on September 25, 2024

• Flip-Chip Bonding Technique To Excite LN Resonators Via Noncontact Electrodes (Yale)

  Published on September 9, 2024

• DL Compiler for Efficiently Utilizing Inter-Core Connected AI Chips (UIUC, Microsoft)

  Published on August 28, 2024

• Characterizing Three Supercomputers: Multi-GPU Interconnect Performance

  Published on August 27, 2024

• 6G And Beyond: Overall Vision And Survey of Research

  Published on July 16, 2024

• On-Chip Communication For Programmable Accelerators In Heterogeneous SoCs (Columbia, IBM)

  Published on July 10, 2024
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