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Technical Paper Home

  • Shaping A Sustainable $1 Trillion Era

    Published on December 19, 2023
  • Important Process Parameter And Its Sensitivity Check By Virtual Fabrication: Channel Hole Profile Impact On Advanced 3D NAND Structure

    Published on December 19, 2023
  • Research Bits: Dec. 18

    Published on December 18, 2023
  • Chip Industry Technical Paper Roundup: Dec 18

    Published on December 18, 2023
  • Chip Industry Week In Review

    Published on December 15, 2023
  • SAP: A Secure Low-Latency Protocol for Mitigating High Computation Overhead in WI-FI Networks

    Published on December 14, 2023
  • Using Real Workloads To Assess Thermal Impacts

    Published on December 14, 2023
  • BYO NPU Benchmarks

    Published on December 14, 2023
  • Data Formats For Inference On The Edge

    Published on December 14, 2023
  • The Journey To Exascale Computing And Beyond

    Published on December 14, 2023
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