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Technical Paper Home

Manufacturing

  • Plasma processing for advanced microelectronics beyond CMOS

    Published on August 27, 2021
  • High-performance flexible nanoscale transistors based on transition metal dichalcogenides

    Published on August 24, 2021
  • Marangoni Effect-Based Under-Layer For A Dual Damascene Via-First Approach

    Published on August 19, 2021
  • Intelligent Agents for the Optimization of Atomic Layer Deposition

    Published on August 5, 2021
  • Extremely Large Exposure Field w/Fine Resolution Lithography Tech To Enable Next-Gen Panel Level Advanced Packaging

    Published on August 5, 2021
  • Tailoring spatial entropy in EUV focused beams for multispectral ptychography

    Published on July 27, 2021
  • Emergent magnetic monopoles isolated using quantum-annealing computer

    Published on July 27, 2021
  • Underlayer Optimization Method For EUV Lithography

    Published on July 21, 2021
  • High-Temperature-Stable, Spin-On Carbon Materials For High-Aspect-Ratio Gap-Fill Applications

    Published on June 16, 2021
  • Improvement Of EUV Si Hardmask Performance Through Wet Chemistry Functionalization

    Published on May 20, 2021
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