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Si2 Open3D Technical Advisory Board

Chartered to define open standards for design data formats and interfaces to enable interoperable 2.5D and 3D design flows


Working groups within the Open3D TAB include: • Power Distribution Network to ensure that each stack in the die has access to the required power supply characteristics
• Thermal design and analysis of an entire 3D stack, including thermal constraints between neighboring dies
• Expression of design constraints into and out of the path-finding and floorplanning stage of the overall design process
• Stress management to ensure that no stack in the die is adversely affected by the stack level stress hot spots or thermal gradients
• Physical verification to facilitate stack level physical DRC verification
• Signal integrity to facilitate stack level electrical modeling

  • Known for: Chip Thermal Interface Protocol, CTIP, 3D-IC,
  • Web: URL
  • Other names: Si2 Open3D TAB
  • Type: Standards Group