Working groups within the Open3D TAB include: • Power Distribution Network to ensure that each stack in the die has access to the required power supply characteristics
• Thermal design and analysis of an entire 3D stack, including thermal constraints between neighboring dies
• Expression of design constraints into and out of the path-finding and floorplanning stage of the overall design process
• Stress management to ensure that no stack in the die is adversely affected by the stack level stress hot spots or thermal gradients
• Physical verification to facilitate stack level physical DRC verification
• Signal integrity to facilitate stack level electrical modeling
