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Si2 Open3D Technical Advisory Board

Chartered to define open standards for design data formats and interfaces to enable interoperable 2.5D and 3D design flows
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Description

Working groups within the Open3D TAB include: • Power Distribution Network to ensure that each stack in the die has access to the required power supply characteristics
• Thermal design and analysis of an entire 3D stack, including thermal constraints between neighboring dies
• Expression of design constraints into and out of the path-finding and floorplanning stage of the overall design process
• Stress management to ensure that no stack in the die is adversely affected by the stack level stress hot spots or thermal gradients
• Physical verification to facilitate stack level physical DRC verification
• Signal integrity to facilitate stack level electrical modeling

  • Known for: Chip Thermal Interface Protocol, CTIP, 3D-IC,
  • Web: URL
  • Other names: Si2 Open3D TAB
  • Type: Standards Group

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