tag: Si2

Reusable Power Models
By Brian Bailey - 14 Aug, 2024 - Comments: 0

Power is not a new concern, and proprietary models are available for some tasks, but the industry lacks standardization. The Silicon Integration Initiative (Si2) is hoping to help resolve that with an upcoming release of IEEE 2416, based on its Unified Power Model (UPM) work. The creation of any model is not to be taken lightly. There is a cost to its creation, verification and maintenance. ... » read more

Uneven Circuit Aging Becoming A Bigger Problem
By Ann Mutschler - 09 Mar, 2023 - Comments: 0

Circuit aging is emerging as a first-order design challenge as engineering teams look for new ways to improve reliability and ensure the functionality of chips throughout their expected lifetimes. The need for reliability is obvious in data centers and automobiles, where a chip failure could result in downtime or injury. It also is increasingly important in mobile and consumer electronics, w... » read more

Week In Review: Design, Low Power
By Jesse Allen - 10 Feb, 2023 - Comments: 0

Arm is heading for an IPO this year, with plans "fairly well developed and underway now," CEO Rene Haas told Reuters. Arm reported fiscal Q3 revenue of $746 million, up 28% compared with the same period in 2021, setting the stage for a public offering. The company noted it had double- or triple-revenue increases in automotive, consumer, infrastructure, and IoT. The Si2 Compact Model Coalit... » read more

Power Issues Causing More Respins At 7nm And Below
By Brian Bailey - 26 Jan, 2023 - Comments: 0

Power consumption has been a major design consideration for some time, but it is far from being a solved issue. In fact, an increasing number of designs have a plethora of power-related problems, and those problems are getting worse in new chip designs. Many designs today are power-limited — or perhaps more accurately stated, thermal-limited. A chip only can consume as much power as it is ... » read more

Designing For Multiple Die
By Ann Mutschler - 21 Dec, 2022 - Comments: 1

Integrating multiple die or chiplets into a package is proving to be very different than putting them on the same die, where everything is developed at the same node using the same foundry process. As designs become more heterogeneous and disaggregated, they need to be modeled, properly floor-planned, verified, and debugged in the context of a system, rather than as individual components. Typi... » read more

Strengthening The Global Semi Supply Chain
By Ann Mutschler - 22 Sep, 2022 - Comments: 0

Within the semiconductor ecosystem, there are a number of dynamics pointing to the need for new ways of partnering in more meaningful ways that bring resiliency to the global semiconductor supply chain. One of these is the move to bespoke silicon, stemming from a shift in the companies that create most SoCs today -- the hyperscalar cloud providers. These market leaders know their workloads so w... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 29 Apr, 2022 - Comments: 0

Automotive, mobility DENSO Corporation and UMC’s Japanese subsidiary United Semiconductor Japan Co., Ltd. (USJC) are collaborating on power semiconductors production for the automotive market at USJC’s 300mm fab. USJC will install an insulated gate bipolar transistor (IGBT) line at its wafer fab. Renesas Electronics uncorked an integrated automotive ECU Virtualization Platform for devel... » read more

Week In Review: Design, Low Power
By Jesse Allen - 08 Apr, 2022 - Comments: 0

Synopsys and Juniper Networks are forming a new, separate company that will provide the industry with an open silicon photonics platform that will include integrated lasers, optical amplifiers, and a full suite of photonic components to form a complete solution that will be accessible through a Process Design Kit (PDK). The new company is being formed, in part, from the carve-out of integrated ... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 04 Mar, 2022 - Comments: 0

From pandemic to war — some of the news this week highlights reactions to Russia’s invasion of Ukraine. Pervasive computing, IoT, 5G and beyond SpaceX sent Starlink satellite dishes to Ukraine to enable Ukrainian access to the Internet. The caveat is the uplink signals from satellite equipment can be used to triangulate the position of the dish, which can then be hit by missile. The dis... » read more

Week In Review: Design, Low Power
By Jesse Allen - 19 Nov, 2021 - Comments: 0

Tools Imperas Software released updated simulator and reference models that support the latest RISC-V extensions for Bit Manipulation 1.0.0, Cryptographic (Scalar) 1.0.0, and Vector 1.0, plus Privilege Specification 1.12. They are offered both as freely available, open-source reference models for the RISC-V community as well as commercial products. Ansys' multiphysics signoff solutions were... » read more

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