Onsemi to buy Synaptics; IBM’s 7Å chip w/40% more SRAM area; 1nm MoS2 nanotubes; AI pressure points; memory updates; $250M CHIPS Act award; trade secret theft; new advanced packaging site; MEMS capacity; humanoids; earnings.

Can engineers trust AI to get everything right in semiconductor design and verification?

Apple-Intel is on, says Trump; Amkor’s big win; Intel 18A-P; Amazon to sell its AI chips; Rambus’ automotive RoT; Brewer’s buy; VLSI Symposium tech; CHIPS Act funding; MIT sensor; RISC-V CPU fuzzing.

Standalone GPUs are being replaced by heterogeneous SoCs and chiplets that combine CPUs, GPUs, and NPUs to eliminate memory bottlenecks, reduce latency, and boost efficiency.

Physical I/Os can be a chokepoint for high-performance chips and high-speed interconnect protocols, requiring design tradeoffs and extra reliability measures.