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The Race To Glass Substrates

Replacing silicon and organic substrates requires huge shifts in manufacturing, creating challenges that will take years to iron out.

Chip Industry Week In Review

New chiplet characterization standard; ST’s new fab; multi-vendor interconnect spec; glass substrates; Arm’s AI-optimized CPUs; NSTC roadmap; China, Malaysia big semi investments; imec’s die-to-wafer hybrid bonding.

Chip Aging Becoming Key Factor In Data Center Economics

Rising thermal density, higher compute demands, and more custom devices can impact processing at multiple levels.

Sidestepping Lithography In Chip Manufacturing

Selective deposition could slow the need for additional lithography steps, helping to control costs for advanced-node chips.

Trouble Ahead For IC Verification

First-time silicon success rates are falling, and while survey numbers point to problem areas, they may be missing the biggest issues.