All jobs will be deleted after 40 days. Jobs must be reposted if it is still open or contact [email protected] before 40 days to extend.
Foundry competition heats up in three dimensions and with novel technologies as planar scaling benefits diminish.
Softbank’s acquisition; advanced packaging funding; glass substrates; engineered copper wire; semi equipment set new record; HBM4; AI chips rake in funding; X-ray inspection; apprenticeships.
DAC; CHIPS funding; CXL standards; Nexperia investment; US curbs tech investments; Accellera’s Federated Simulation Group; European sustainability concerns; SIA’s tracking tool; Multibeam’s multicolumn litho system.
Leading-edge foundry plans; DoD IC center; 300mm funding; Intel’s apprenticeship program; metrology and test acquisitions; Keysight’s chiplet PHY simulation; thermal management in 3D-ICs; foundry growth.
Big rounds for AI chips; 91 startups raise $2.6 billion.
