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Technical Paper Home

Power & Performance

  • Advantages Of IPL Soldering Over Reflow Soldering For Cu Pillar Bump Interconnections On Glass Substrates (Chungbuk, Sungkyunkwan Univ.)

    Published on November 21, 2025
  • A Decade Of Architectural RowHammer Defense Solutions (Meta, SNU, UIUC)

    Published on November 19, 2025
  • Intelligence Per Watt: Measuring Local Inference Viability, Studying 20+ Models, 8 HW Accelerators (Stanford Univ.)

    Published on November 18, 2025
  • New Interconnect Materials Beyond Copper (Florida State Univ., Cornell)

    Published on November 14, 2025
  • Comparative Analysis of CFET and NSFET Architectures (TU Munich, IIT)

    Published on November 14, 2025
  • Parallel Implementation Of Nonlinear Functions Using An Optical Processor (UCLA)

    Published on November 12, 2025
  • Silicon Photonic Interconnected Chiplets With Computational Network And IMC For LLM Inference Acceleration (NUS)

    Published on November 10, 2025
  • Free-Space Gated Transistor In Wide Bandgap And Ultra Wide Bandgap Semiconductors (KAUST Et Al.)

    Published on November 10, 2025
  • Study of Compute Efficiency And Density Of 3 Photonic Computing Architectures (IBM et al.)

    Published on November 9, 2025
  • Co-Optimizing GPU Architecture And SW To Enhance Edge Inference Performance (NVIDIA)

    Published on November 5, 2025
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