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Manufacturing

• Flexible-Wafer Platform And CMOS-Compatible 300mm Wafer-Scale Integrated-Photonics Fabrication

  Published on August 3, 2024

• Classification and Localization of Semiconductor Defect Classes in Aggressive Pitches (imec, Screen)

  Published on August 1, 2024

• Monolithic 3D TFT Integration at Room Temperature, Used to Stack 10 Vertical Layers

  Published on July 12, 2024

• Interconnects: Criteria For Alternative Metal Benchmarking And Selection (Imec, KU Leuven)

  Published on June 19, 2024

• Plasma Etching : Challenges And Options Going Forward (UMD, IBM, Lam Research, Intel, Samsung et al.)

  Published on June 18, 2024

• Device Characteristics of GAA-Structured CMOS and CTFET Under Varying Temperatures

  Published on June 10, 2024

• Imperceptible, Lightweight Sensors Directly Printed on Biological Surfaces

  Published on May 28, 2024

• Demonstrating The Feasibility Of The Foundry Model For Flexible Thin-Film Electronics 

  Published on May 15, 2024

• Testing/Probing Single Electrons Across 300mm Spin Qubit Wafers (Intel)

  Published on May 15, 2024

• Controllable Interaction Between Two Hole Spin Qubits In A Conventional Silicon Transistor

  Published on May 15, 2024
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