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Manufacturing

• Scaling Nanoribbon Transistors Based on Monolayer 2D Semioconductors (Stanford, HORIBA, SLAC)

  Published on October 3, 2025

• CDI For The Metrology Of Copper Pads Used In Hybrid Bonding (Paul Scherrer Institute, Samsung)

  Published on October 3, 2025

• Lightweight AI Techniques For Automated Inspection of Silicon Wafers (Fraunhofer)

  Published on October 3, 2025

• Critical Challenges and Opportunities Related to Polymer-Based Materials in Semiconductor Packaging (NIST, NC State, NREL et al)

  Published on September 11, 2025

• Overview of Incorporating LLMs into EDA, With 3 Case Studies (TU Munich et al.)

  Published on September 5, 2025

• Wafer-Scale Heterogeneous Integration of Lithium Tantalate Films on Low-Loss Silicon Nitride Photonic ICs (EPFL, KIT, CAS, IPQ)

  Published on September 3, 2025

• Electrochemical Absorption of Hydrogen in Structured Palladium Thin-Film Electrodes (Univ. of Bristol)

  Published on August 29, 2025

• Nanofabrication Protocol That Allows Patterning Metallic Electrodes on 2D Materials Reliably (KAUST, National University of Singapore)

  Published on August 25, 2025

• The Severity Of Test Escapes And SDCs Caused By Them (Google)

  Published on August 15, 2025

• Epitaxial Growth Of Up To 120 Si/SiGe Bilayers In View of 3D DRAM Applications (imec, Ghent Univ.)

  Published on August 5, 2025
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