A new technical paper titled “Coherent diffractive imaging simulations for wafer inspection of periodic structures” was published by researchers at the Paul Scherrer Institute and Samsung.
Excerpt
“We present a study of phase retrieval algorithms applied to the metrology of copper pad topography for hybrid bonding. We demonstrate that by including a priori information in the update function of the object, a better estimation of the recession of the copper pads can be achieved, leading to an improved metrology by CDI.”
Find the technical paper here. September 2025.
Ansuinelli, Paolo, Hojun Lee, Wookrae Kim, Junho Shin, Yasin Ekinci, and Iacopo Mochi. “Coherent diffractive imaging simulations for wafer inspection of periodic structures.” Journal of Micro/Nanopatterning, Materials, and Metrology 24, no. 4 (2025): 041403-041403.
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