CDI For The Metrology Of Copper Pads Used In Hybrid Bonding (Paul Scherrer Institute, Samsung)


A new technical paper titled "Coherent diffractive imaging simulations for wafer inspection of periodic structures" was published by researchers at the Paul Scherrer Institute and Samsung. Excerpt "We present a study of phase retrieval algorithms applied to the metrology of copper pad topography for hybrid bonding. We demonstrate that by including a priori information in the update functi... » read more