A new technical paper titled “Towards efficient wafer visual inspection: Exploring novel lightweight approaches for anomaly detection and defect segmentation” was published by researchers at Fraunhofer Portugal AICOS.
Excerpt
“AI has made significant strides in unsupervised anomaly detection and supervised defect segmentation, yet its application to wafer inspection remains underexplored. This work bridges these fields by investigating cutting-edge lightweight AI techniques for automated inspection of current generation of silicon wafers.”
Find the technical paper here. September 2025.
Façoco, Ivo, Rafaela Carvalho, and Luís Rosado. “Towards efficient wafer visual inspection: Exploring novel lightweight approaches for anomaly detection and defect segmentation.” Intelligent Systems with Applications (2025): 200576.
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