Companies battle it out to get artificial intelligence to the edge using various chip architectures as their weapons of choice.
Bulk CMOS, FD-SOI and finFETs all on tap as big players vie for differentiation. But where will chipmakers go after 28nm?
Consortiums seek ways to ensure interoperability of hardened IP as way of cutting costs, time-to-market, but it’s not going to be easy.
No shortage of alternatives as materials, packaging and architectural options grow, and plenty of startups are jumping in.
Applied Materials circles market as demand for next-gen technology grows.
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