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Amkor Technology

Packaging and test provider.
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Description

Amkor provides wafer level and package assembly and test services. The company offers support for a wide range of packaging technologies. Test services include high-speed logic, mixed-signal, analog, high power, and RF.

Amkor originated in ANAM Industries, founded in 1945 in South Korea as a bicycle parts manufacturer. The company entered semiconductor manufacturing in 1968 and adopted the Amkor Electronics name. In May 1998, Amkor listed on NASDAQ (AMKR).

  • Founded: 1968
  • Founders: Hyang-Soo Kim, Joo-Jin (James) Kim
  • HQ: Tempe, AZ, USA
  • Website: https://amkor.com/
  • Other Names: Amkor Electronics, ANAM Industries

Acquisitions

May 2017: Acquired Portuguese wafer level fan-out semiconductor packaging provider NANIUM.

February 2016: Became full owner of J-Devices.

July 2013: Acquired Toshiba’s automotive semiconductor operation in Malaysia.

March 2013: With J-Devices, acquired three additional semiconductor plants in Japan from Renesas Semiconductor.

February 2012: With J-Devices, acquired two additional semiconductor plants in Japan from Fujitsu Semiconductor.

October 2009: Established J-Devices in Kyushu, Japan through joint venture with NMD and Toshiba, based on the assembly and test operations of Toshiba.

August 2004: Acquired Unitive (USA and Taiwan Corporation).

May 2004: Acquired IBM Singapore test plant.

May 2004: Acquired a semiconductor plant in Shanghai, China from IBM.

May 2002: Acquired Citizen Watch semiconductor assembly business.

March 1989: Acquired AMD semiconductor plant, establishing Amkor Philippines.

  • Type: Company

Tags



Multimedia

Challenges Of Testing Advanced Packages

Multimedia

Challenges Of Heterogeneous Integration

Multimedia

Challenges In Packaging 5G And 6G