Chip Industry Week In Review

By The SE Staff - 18 Apr, 2025 - Comments: 0

[Podcast version is here.] TSMC said it will produce 30% of its leading-edge chips in Arizona when all six of its fabs are operational, a total investment of $165 billion, Axios reported. In its latest SEC filing, the foundry said it continues to add capacity in Taiwan, Arizona, Japan, and Germany. The Trump administration launched a Section 232 investigation into semiconductors and relat... » read more

Benefits And Challenges In Multi-Die Assemblies

By Ed Sperling And Laura Peters - 02 Apr, 2025 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss chiplets, hybrid bonding, and new materials with Michael Kelly, vice president of Chiplets and FCBGA Integration at Amkor; William Chen, fellow at ASE; Dick Otte, CEO of Promex Industries; and Sander Roosendaal, R&D director at Synopsys Photonics Solutions. What follows are excerpts of that discussion. To view part one of t... » read more

Need For KGD Drives Singulated Die Screening

By Anne Meixner - 31 Mar, 2025 - Comments: 0

The move to multi-die packaging is driving chipmakers to develop more cost-effective ways to ensure only known-good die are integrated into packages, because the price of failure is significantly higher than with a single die. Better methods for inspecting and testing these devices are already starting to roll out. High-throughput infrared inspection is capable of catching more sub-surface d... » read more

What’s Next In Advanced Packaging?

By Ed Sperling And Laura Peters - 19 Feb, 2025 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss 3D-IC progress and issues, photonics, and tradeoffs with different interposers and bridge technologies, with Michael Kelly, vice president of Chiplets and FCBGA Integration at Amkor; William Chen, fellow at ASE; Dick Otte, CEO of Promex Industries; and Sander Roosendaal, R&D director at Synopsys Photonics Solutions. What fo... » read more

Chip Industry Week In Review

By The SE Staff - 14 Feb, 2025 - Comments: 0

Worldwide silicon wafer shipments declined nearly 2.7% to 12,266 million square inches in 2024, with wafer revenue contracting 6.5% to $11.5 billion, according to the SEMI Silicon Manufacturers Group. CSIS released a new report, “Critical Minerals and the Future of the U.S. Economy,” with detailed analysis and policy recommendations for building a secure mineral supply chain for semicond... » read more

Universities Augment Engineering Curricula To Boost Employability

By Liz Allan - 05 Feb, 2025 - Comments: 0

Increasing numbers of universities are offering semiconductor courses in their engineering programs, and also in math, physics, and business degrees. Most universities now offer a broad foundation so students can pivot to other industries during cyclical downturns, or when technology and science create entirely new and potentially lucrative opportunities, such as generative AI, advanced pack... » read more

Advanced Packaging Moving At Breakneck Pace

By Ed Sperling And Laura Peters - 29 Jan, 2025 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss advances in packaging with Michael Kelly, vice president of Chiplets and FCBGA Integration at Amkor; William Chen, fellow at ASE; Dick Otte, CEO of Promex Industries; and Sander Roosendaal, R&D director at Synopsys Photonics Solutions. What follows are excerpts of that discussion. [Part 2 of the discussion is here.] ... » read more

Assembly Design Rules Slowly Emerge

By Bryon Moyer - 27 Jan, 2025 - Comments: 0

Process design kits (PDKs) play an essential in ensuring that silicon technology can proceed from one generation to the next in a manner that design tools can keep up with. No such infrastructure has been needed for packaging in the past, but that's beginning to change with advanced packages. Heterogeneous assemblies are still ramping up, but their benefits are attracting new designs. “Chi... » read more

An Innovative Hybrid Cleaning Approach For Contaminant Removal in Semiconductor Packaging

By Chun Yuan Lim - 23 Jan, 2025 - Comments: 0

The growing demand for power semiconductors, which control large currents and voltages, has resulted in their widespread use in various electronic devices, including electric vehicles (EVs). The requirement for greater performance and smaller devices has led to increased operating temperatures for these power semiconductors. This rise in temperature poses a challenge as it often leads to delami... » read more

Global IC Fabs And Facilities Report: 2024

By Liz Allan - 21 Jan, 2025 - Comments: 0

The chip industry made significant capital investments this year to build new fabs and facilities or expand existing premises. A number of sites were dedicated to SiC, GaN, DRAM, HBM, along with packaging and assembly by OSATs, and essential gases, chemicals, and other components. More than a dozen R&D centers were also established for 8-inch wafers, EUV, and advanced packaging. Investments... » read more

← Older posts

tag: Amkor

Chip Industry Week In Review

Benefits And Challenges In Multi-Die Assemblies

Need For KGD Drives Singulated Die Screening

What’s Next In Advanced Packaging?

Chip Industry Week In Review

Universities Augment Engineering Curricula To Boost Employability

Advanced Packaging Moving At Breakneck Pace

Assembly Design Rules Slowly Emerge

An Innovative Hybrid Cleaning Approach For Contaminant Removal in Semiconductor Packaging

Global IC Fabs And Facilities Report: 2024

Trending Articles

Startup Funding: Q1 2025

Advanced Packaging Fundamentals for Semiconductor Engineers

Big Changes Ahead For Interposers And Substrates