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Enabling The 5G RF Front-End Module Evolution With The DSMBGA Package

A DSMBGA technology that delivers integration levels in a small form factor with high yield.

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The advanced SiP double-sided molded BGA platform has become an industry technology standard in this domain. Applying leading-edge design rules for 3D component placement and double-sided molding, together with conformal and compartmental shielding and in-line RF testing, delivers integration levels in a small form factor with high yield. In addition to formidable SiP capacity and DSMBGA technology, an extensive toolset has been developed to maximize performance and to address the sophisticated packaging formats required to productize 5G applications. Some of these tools include AiP, substrate-embedded die, wafer-level SiP and a variety of RF shielding design options.

Click here to access a PDF of the article by Amkor’s Curtis Zwenger.



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