tag: Amkor Technology

Electromigration Concerns Grow In Advanced Packages
By Laura Peters - 18 Apr, 2024 - Comments: 0

The incessant demand for more speed in chips requires forcing more energy through ever-smaller devices, increasing current density and threatening long-term chip reliability. While this problem is well understood, it's becoming more difficult to contain in leading-edge designs. Of particular concern is electromigration, which is becoming more troublesome in advanced packages with multiple ch... » read more

Silicon Photonics Manufacturing Ramps Up
By Gregory Haley - 21 Mar, 2024 - Comments: 0

Circuit scaling is starting to hit a wall as the laws of physics clash with exponential increases in the volume of data, forcing chipmakers to take a much closer look at silicon photonics as a way of moving data from where it is collected to where it is processed and stored. The laws of physics are immutable. Put simply, there are limits to how fast an electron can travel through copper. The... » read more

Fan-Out Panel-Level Packaging Hurdles
By Anne Meixner - 24 Jan, 2024 - Comments: 0

Fan-out panel-level packaging (FOPLP) promises to significantly lower assembly costs over fan-out wafer-level packaging, providing the relevant processes for die placement, molding and redistribution layers (RDLs) formation can be scaled up with equivalent yield. There is still much work to be done before that happens. Until now, FOPLP has been adopted for devices that are manufactured in ve... » read more

Elimination Of Die-Pop Defect By Vacuum Reflow For Ultrathin Die With Warpage In Semiconductor Packaging Assembly
By Amkor - 18 Jan, 2024 - Comments: 0

Semiconductor die thickness is getting thinner over time due to improvement of power efficiency in advance power electronic packages. Ultrathin die with convex warpage can easily deteriorate the solder void removal process during solder reflow, leading to various packaging reliability issues. In particular, a new type of packaging defect phenomenon—die-pop—is observed. Vacuum reflow process... » read more

Many More Hurdles In Heterogeneous Integration
By Laura Peters - 18 Jan, 2024 - Comments: 0

Advanced packaging options continue to stack up in the pursuit of “More than Moore” and higher levels of integration. It has become a place where many high-density interconnects converge, and where many new and familiar problems need to be addressed. The industry’s first foray into fine-pitch multi-die packaging utilized silicon interposers with through-silicon vias (TSVs) to deliver s... » read more

Navigating Heat In Advanced Packaging
By Gregory Haley - 18 Jan, 2024 - Comments: 0

The integration of multiple heterogeneous dies in a package is pivotal for extending Moore’s Law and enhancing performance, power efficiency, and functionality, but it also is raising significant issues over how to manage the thermal load. Advanced packaging provides a way to pack more features and functions into a device, increasingly by stacking various components vertically rather than ... » read more

Plugging Gaps In The IC Supply Chain
By Anne Meixner - 09 Jan, 2024 - Comments: 0

Multiple touch points in manufacturing and packaging are exposing gaps in the data used to track different components, making it difficult to identify the source of issues that can affect yield and reliability, and opening the door to counterfeit or sub-standard parts. This involves more than just assigning a simple identifying code to a chip. At different points in a device's lifecycle, new... » read more

Making Heterogeneous Integration More Predictable
By Ed Sperling - 29 Nov, 2023 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss problems and potential solutions in heterogeneous integration with Dick Otte, president and CEO of Promex Industries; Mike Kelly, vice president of chiplets/FCBGA integration at Amkor Technology; Shekhar Kapoor, senior director of product management at Synopsys; John Park, product management group director in Cadence's Custom I... » read more

Wirebonding Is Here To Stay
By Gregory Haley - 19 Oct, 2023 - Comments: 0

Few technologies in semiconductor manufacturing have stood the test of time as steadfastly as wirebonding. This process, which involves electrically connecting semiconductor devices to their packages, has been a cornerstone of the electronics industry since the beginning of the electronics industry. Like everything else in the semiconductor market, wirebonding technologies have changed over ... » read more

Heterogeneous Integration Finding Its Footing
By Ed Sperling - 19 Oct, 2023 - Comments: 0

Semiconductor Engineering sat down to discuss heterogeneous integration with Dick Otte, president and CEO of Promex Industries; Mike Kelly, vice president of chiplets/FCBGA integration at Amkor Technology; Shekhar Kapoor, senior director of product management at Synopsys; John Park, product management group director in Cadence's Custom IC & PCB Group; and Tony Mastroianni, advanced packagin... » read more

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