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• All-Digital MDL-Based Fast Lock Clock Generator For Low-Power Chiplet-Based SoC Design

  Published on December 14, 2022

• An Arrangement of Chiplets That Outperforms A Grid Arrangement (ETH Zurich / U. of Bologna)

  Published on December 1, 2022

• Hardware Trojans Target Coherence Systems in Chiplets (Texas A&M / NYU)

  Published on December 1, 2022

• Cost Characteristics of the 2.5D Chiplet-Based SiP System

  Published on November 8, 2022

• Securing Heterogeneous Integration at the Chiplet, Interposer, and System-In-Package Levels (FICS-University of Florida)

  Published on August 4, 2022

• Delay-based PUF for Chiplets to Verify System Integrity

  Published on July 8, 2022

• Flip-Chip Integration of a GaSb Semiconductor Optical Amplifier with a Silicon Photonic Circuit

  Published on July 1, 2022

• Thermal Management Challenges and Requirements of 3 types of Microelectronic Devices

  Published on June 20, 2022

• Review of Bumpless Build Cube Using Wafer-on-Wafer & Chip-on-Wafer for Tera-Scale 3D Integration

  Published on June 20, 2022

• Cu/SiO₂ Hybrid Bond Interconnects

  Published on June 10, 2022
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