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Technical Paper Home

Packaging

  • Chiplet Architecture: Scalable and Cost-Efficient Systems for Irregular Applications (Princeton)

    Published on November 30, 2023
  • Chiplets For Generative AI Workloads: Challenges in both HW and SW

    Published on November 29, 2023
  • A Fast And Unified Toolchain For Rapid Design Space Exploration Of Chiplet Architectures

    Published on November 27, 2023
  • Analyzing The U.S. Advanced Packaging Ecosystem With Countermeasures To Mitigate HW Security Issues

    Published on October 27, 2023
  • Leveraging In-Package Wireless Technology To Improve The Thermal Behavior Of 2.5D Chiplet-Based SoP

    Published on September 19, 2023
  • A Chiplet-Based Fully Homomorphic Encryption Accelerator

    Published on August 18, 2023
  • Flexible Hybrid Electronics: Future Standards For Next-Gen 5G/mmWave Wearable and Conformal Applications

    Published on August 15, 2023
  • A Performance-Aware Framework For Co-Optimizing Floorplan And Performance Of Chiplet-Based Architecture

    Published on August 10, 2023
  • A Search Framework That Optimizes Hybrid-Device IMC Architectures For DNNs, Using Chiplets

    Published on August 8, 2023
  • Industry 4.0 Paradigms For Chip Workforce Development And Domestic Production: Using Automation And AR/VR

    Published on August 7, 2023
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