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Packaging

• Thermal Modeling For 2.5D And 3D Integrated Chiplets

  Published on October 16, 2024

• Securing Advanced Packaging Supply Chain With Inherent HW Identifiers Using Imaging Techniques

  Published on October 14, 2024

• Chiplet-Level HI of Polymer-Based Circuits For Fabricating Flexible Electronic-Photonic Integrated Devices

  Published on October 9, 2024

• Fine-Grained Functional Partitioning For Low Level SRAM Cache in 3D-IC designs (imec)

  Published on September 27, 2024

• Method To Determine The Permittivity of Dielectric Materials in 3D Integrated Structures At Broadband RF Frequencies

  Published on September 25, 2024

• SIA’s Report On the State of the U.S. Semiconductor Industry

  Published on September 18, 2024

• 3D IC Partitioning and Placement Method That Optimizes For Critical Paths (POSTECH)

  Published on September 12, 2024

• Scalable Chiplet System for LLM Training, Finetuning and Reduced DRAM Accesses (Tsinghua University)

  Published on September 4, 2024

• ECTC 2024 Session Readout: Advancement of Metrology

  Published on September 4, 2024

• Heterogeneity Of 3DICs As A Security Vulnerability

  Published on August 1, 2024
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