Technical Paper Home

Packaging

• Microelectronics and Advanced Packaging Technologies Roadmap 2.0 (SRC)

  Published on October 14, 2025

• On-Package Memory With UCIe To Improve Bandwidth Density And Power Efficiency (AMD, Intel Corp.)

  Published on October 10, 2025

• Framework for Optimizing Reliability and Thermal Management of 3DICs (National Taiwan Univ., Lamar Univ.)

  Published on October 10, 2025

• Wafer Warpage Evolution During Key Backside Power Delivery Network Fabrication Steps (Korea Univ., Georgia Tech)

  Published on October 8, 2025

• A Modular System In Package Approach For Automotive Short Range Radar Applications (Ruhr Univ. Bochum, Fraunhofer et al.)

  Published on October 3, 2025

• Distributed Authentication Framework Leveraging Multi-Party Computation In A Scalable Tree-Based Architecture (Univ. of Central Florida, Louisiana State)

  Published on October 2, 2025

• Critical Challenges and Opportunities Related to Polymer-Based Materials in Semiconductor Packaging (NIST, NC State, NREL et al)

  Published on September 11, 2025

• HW Security: 2.5D and 3D Technologies Provide Opportunities in Designing Secure Systems (UCSB, Columbia)

  Published on September 5, 2025

• Thermally-Aware, Multi-Objective Scheduling Framework for DL Workloads on Heterogeneous Multi-Chiplet PIM Architectures (UW–Madison, Washington State)

  Published on August 19, 2025

• Scheduling Architecture Integrated With M3D BEOL Memories For LLM Inference (Georgia Tech, Samsung)

  Published on August 19, 2025
Page 4 of 17
• ‹ Previous
• 1
• 2
• 3
• 4
• 5
• 6
• 7
• 8
• Next ›
• Last »