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Packaging

• Distributed Batteries Within a Heterogeneous 3D IC

  Published on March 12, 2024

• UCIe-3D: SiP Architectures With Advanced 3D Packaging With Shrinking Bump Pitches (Intel)

  Published on March 12, 2024

• Heterogeneous Integration And Electronics Packaging Manufacturing Roadmap (SEMI & UCLA)

  Published on February 9, 2024

• Chiplet Heterogeneity And Advanced Scheduling With Pipelining

  Published on January 12, 2024

• Challenges And Innovations Of HW Security And Trust For Chiplet-Based 2.5D and 3D ICs

  Published on January 4, 2024

• Design Space Simulator Of Distributed Multi-Chiplet Manycore Architectures For Comm-Intensive Applications

  Published on January 4, 2024

• Environmentally Sustainable FPGAs (Notre Dame, Univ. of Pittsburgh)

  Published on December 21, 2023

• Chiplet Architecture: Scalable and Cost-Efficient Systems for Irregular Applications (Princeton)

  Published on November 30, 2023

• Chiplets For Generative AI Workloads: Challenges in both HW and SW

  Published on November 29, 2023

• A Fast And Unified Toolchain For Rapid Design Space Exploration Of Chiplet Architectures

  Published on November 27, 2023
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