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Topology for Substrate Routing in Semiconductor Package Design

New signal routing method for solving routing problems that occur in the design process of semiconductor package substrates.

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Abstract:

In this work, we propose a new signal routing method for solving routing problems that occur in the design process of semiconductor package substrates. Our work uses a topological transformation of the layers of the package substrate in order to simplify the routing problem into a problem of connecting points on a circle with non-intersecting straight line segments. The circle, which we call the Circular Frame, is a polygonal schema, which is originally used in topology to study the topological structure of 2-manifolds. We show through experiments that our new routing method based on the Circular Frame competes with certain grid-based routing algorithms.

View this technical paper here. Published 05/2021.

Seong, R.-K., Yang, J., & Han, S.-H. (2021, May 17). Topology for substrate routing in semiconductor package design. arxiv.org.



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