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Wafer fabrication equipment
LAST UPDATED ON July 20th, 2019
Lam Research makes wafer fabrication equipment. Its portfolio includes products for thin film deposition, plasma etch, photoresist strip, wafer cleaning, and high-precision mass metrology.
David K. Lam founded the company in 1980 in Santa Clara, California. The company went public in 1984.
Innovations, products:
- The AutoEtch, released in 1981.
- Rainbow etch system in 1987.
- First MSSD system, Concept One PECVD in 1987.
- Invented single-wafer spin clean technology 1988.
- SP Series spin clean systems in 1991.
- Transformer Coupled Plasma conductor etch products in 1992.
- Released Concept Two ALTUS CVD tungsten system in 1993.
- Introduced first Dual Frequency Confined dielectric etch product in 1995.
- Introduced SPEED HDP-CVD system 1996.
- Announced SABRE ECD system in 1998.
- Announced 2300 etch platform in 2000.
- Launched VECTOR PECVD system in 2000.
- Launched Da Vinci spin clean product in 2003.
- Introduced first-generation Kiyo and Flex etch products in 2004.
- Introduced ALTUS tungsten barrier CVD system in 2004.
- Launched SOLA UVTP film treatment system in 2005.
- Shipped first Syndion system for through-silicon via etch in 2007.
- Introduced DV-Prime spin clean system in 2007.
- Launched Coronus plasma bevel clean system in 2007.
- Introduced GAMMA GxT and GAMMA G400 strip systems in 2008.
- Announced SABRE 3D ECD system for wafer-level packaging in 2010.
- Introduced product suite for 3D NAND: ALTUS Max ICEFill W-CVD, VECTOR Strata PECVD, Flex F Series dielectric etch in 2014.
- Introduced solutions for multiple patterning: VECTOR, Kiyo F Series conductor etch products in 2014.
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