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Special Reports

Partitioning In The Chiplet Era

By: Ann Mutschler

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

Using AI To Glue Disparate IC Ecosystem Data

By: Ed Sperling and Ann Mutschler

Why the chip industry is so focused on large language models for designing and manufacturing chips, and what problems need...

Memory Fundamentals For Engineers

By: The SE Staff

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and...

Preparing For Ferroelectric Devices

Managing crystal structure for ferroelectric performance.

October 2nd, 2024 By Katherine Derbyshire

Barriers To Chiplet Sockets

Perfection sometimes stands in the way of progress, and there is evidence this may be h...

September 30th, 2024 By Brian Bailey

RAG-Enabled AI Stops Hallucinations, Adds Sources

New GenAI method enables better answers and performs more functions.

September 26th, 2024 By Karen Heyman

Pressure Builds To Adopt Virtual Prototypes

Creating complex multi-chiplet systems is no longer a back-of-the-envelope diagram, but...

September 26th, 2024 By Brian Bailey

Devising Security Solutions For Hardware Threats

Keeping up with attackers is proving to be a major challenge with no easy answers; trai...

September 25th, 2024 By Adam Kovac

Optimizing Wafer Edge Processes For Chip Stacking

Several critical processes address wafer flatness, wafer edge defects and what's needed...

September 23rd, 2024 By Laura Peters

How Die Dimensions Challenge Assembly Processes

Chiplet-based products must accommodate small differences in die size and bump pitch, p...

September 19th, 2024 By Anne Meixner

New Materials Are in High Demand

Development methodologies combine old and new techniques, but getting any new material ...

September 19th, 2024 By Bryon Moyer

Managing EMI in High-Density Integration

Controlling interference in today’s SoCs and advanced packaging requires a combinatio...

September 19th, 2024 By Gregory Haley

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that i...

September 18th, 2024 By Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations...

September 17th, 2024 By The SE Staff

CXL Thriving As Memory Link

Adoption of Compute Express Link protocol spreads as way to connect memories.

September 16th, 2024 By Karen Heyman

Latest News

Chip Industry Week In Review

Amkor-TSMC deal; new law speeds semiconductor projects; NSTC launch; quartz supply; chiplet partitioning; semiconductor materials; ferroelectric devices; data cen...

October 4th, 2024 By The SE Staff

Chip Industry Week In Review

Google's AlphaChip; 300mm fab equip spending; TSMC-EDA partnerships; $123M CHIPS Act; CXL memory standards; MIPI's A-PHY v2.0; 12-stack HBM3E; LLMs for chip desig...

September 27th, 2024 By The SE Staff

more news »

more research »

Startup Corner

Startup Funding: Q2 2024

Big rounds for AI chips; 91 startups raise $2.6 billion.

By Jesse Allen

Startup Funding: March 2024

Investors connect with interconnects; $1.1 billion for 39 comp...

By Jesse Allen

more startups »

Special Reports

Top Stories

Preparing For Ferroelectric Devices

Barriers To Chiplet Sockets

RAG-Enabled AI Stops Hallucinations, Adds Sources

Pressure Builds To Adopt Virtual Prototypes

Devising Security Solutions For Hardware Threats

Optimizing Wafer Edge Processes For Chip Stacking

How Die Dimensions Challenge Assembly Processes

New Materials Are in High Demand

Managing EMI in High-Density Integration

What Comes After HBM For Chiplets

Memory Fundamentals For Engineers

CXL Thriving As Memory Link

Latest News

Chip Industry Week In Review

Chip Industry Week In Review

Research

Research Bits: Oct. 1

Chip Industry Technical Paper Roundup: Oct. 1

Research Bits: Sept. 24

Startup Corner

Startup Funding: Q2 2024

Startup Funding: March 2024

Videos

Working With Chiplets

Data Routing In Heterogeneous Chip Designs

Emerging Technologies Driving Heterogeneous Integration

Real-Time Safety Monitoring

Knowledge Centers / Entities, people and technologies explored

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