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QP Technologies

IC packaging and assembly services.


QP Technologies provides prototype and volume IC packaging and IC assembly services, as well as wafer preparation. Packaging offerings include over-molded QFN/DFN packages and pre-molded air cavity QFN packages. In addition to wire bond assembly, the company assembles flip chips, BGAs, stacked die, sensors, MEMS, chip-on-board (COB) and chip-on-flex assemblies.

Originally called SPT, the company was founded in 1994. In 2000, device handling company Gel-Pak acquired SPT, which was renamed Quik-Pak. The companies reorganized in 2004 under the name Delphon Industries. In April 2015, the Quik-Pak division was acquired by Promex Industries, which focuses on microelectronic design, packaging, and assembly for medical and biotech devices. In 2021, Quik-Pak was re-named QP Technologies.

  • Founded: 1994 (as SPT)
  • Founder: Joe Dlugokecki
  • HQ: San Diego, CA, USA
  • Website:
  • Other Names: SPT, Quik-Pak


November 2019: Acquired wafer preparation firm QBBS.

September 2008: Acquired Aguila Technologies’ flip chip assembly, detector array processing, and laser micromachining business units.

  • Type: Company


Heterogeneous Integration Issues And Developments


Open Cavity Plastic Packaging