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U.S. Chip Packaging With Mil-Spec Precision

Why open-cavity plastic packages are necessary for future mil-aero applications.

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Download this white paper to learn:

  • How you can transform your plastic package dummies, test rejects, and excess inventory into ready-to-assemble components
  • The value of an onshore solution for navigating around ITAR supply constraints
  • The benefits from producing chip prototypes that are mechanically and electrically identical to future molded production parts
  • Why Open-Cavity Plastic Packages’ (OCPP) longevity and durability specs make them an ideal solution for mil-aero machinery

This paper details a real-world use case where dummy IC packages converted to Open-Cavity Plastic Packages (OCPP) passed stringent burn-in and MSL tests just like factory-fresh parts.

Click here to read more.



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